A DUAL WAVELENGTH LASER MICROMACHINING SYSTEM OFFERING HIGH THROUGHPUT IN A DEMANDING INDUSTRIAL SETTING, OR HIGH QUALITY, HIGH-FLEXIBILITY PROCESS DEVELOPMENT IN AND R&D ENVIRONMENT. 

Some lasers are unsuitable for machining some materials – they are not suitably absorbed, making machining slow or ineffective. A dual wavelength system allows maximum flexibility by increasing the range of materials that you can machine. This capability allows composite materials to be processed, reducing process steps and reducing costs.

The turn-key system features a class 1 enclosure, which ensures that your operator remains safe. The vibration isolated granite machining bed ensures ultimate stability and guarantees maximum repeatability and minimum wastage in the parts produced.

Oxford Lasers’ advanced CNC controller and software means that you can go from CAD model to a produced part in one simple step, with single screen software control. The linear stage offer 300mm X-Y travel (optionally increased to 400mm) and 150mm Z. An on-axis vision system simplifies alignment and allows inspection of parts as they are finished.

If required, we can add trepanning systems, galvo scanners, taper reduction systems, auto-focus and auto-alignment, height and depth sensors, 4th and 5th axes (rotation), temperature stabilisation and fume extraction.

TECHNICAL SPECIFICATIONS

LASER

Laser Type : Diode Pumped Solid State
Wavelength : 
  • 1064mm and 532mm
  • 1064mm and 355mm
  • 532mm and 355mm
  • 532mm and 266mm
  • 355mm and 266mm

CNC

Travel Range : Up to 500nm Travel XY and Up to 150mm Travel Z
Optional : 4th and 5th rotation
Galvo Head : Fast GX, GY for milling
IFOV : Infinite Field Of View for Galvo head

Mechanical

Dimensions (L x W x H) : 3100(W) x 1560(D) x 2050(H) mm
Weight : approx. 3150 kg
Single Phase Electrical Installation

MAIN INDUSTRIES AND APPLICATIONS

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