A ROBUST LASER MICROMACHINING SYSTEM DESIGNED FOR HIGH-PRECISION LASER MACHINING PRODUCTION. DESIGNED AS A MACHINE-TOOL, READY TO FIT INTO YOUR R&D OR PRODUCTION FACILITY. C/E SERIES SYSTEMS CAN BE CONFIGURED FOR MICRODRILLING, MICROCUTTING, MICROMILLING OR FOR A COMBINATION OF PROCESSES. 

C/E-Series state-of-the-art turnkey laser micromachining systems are designed specifically to provide stable, reproducible production in a tough environment. The system is built around a large granite frame mounted on a vibration isolation platform, thus making the system impervious to ambient vibration. The class 1 enclosure protects the system from contamination and changes in temperature. Oxford Lasers Cimita micromachining software simplifies manufacturing by allowing you to go straight from CAD model to production. 
A range of diode pumped, solid state lasers are offered, providing a range of wavelengths and powers for all production needs. With the correct choice of laser, almost all solids can be machined including: metals (e.g. stainless steel, tungsten, titanium, copper, aluminium), ceramics (e.g. alumina, zirconia, silicon nitride), super-hard materials (e.g. diamond, tungsten carbide), semiconductors (e.g. silicon), graphite and plastics (e.g. polyimide, PMMA, polycarbonate). Composites and laminates can also be machined.

TECHNICAL SPECIFICATIONS

LASER

Laser Type : Diode Pumped Solid State
Wavelength : 266 nm/ 355 nm/ 532 nm/ 1064 nm

CNC

Travel Range : Up to 450nm Travle XY / Up to 150nm Travel Z
Optional : 4th and 5th rotation
Galvo Head : Fast GX, GY for milling
IFOV : Infinite Field Of View for Galvo head

MECHANICAL

Dimensions (L x W x H) : 2800(W) x 1560(D) x 2050(H) mm
Weight : approx. 2300 kg
Single Phase Installation

VISION & FOCUS

Vision : Industrial fast vision camera
Lighting : Gelvo light for clear micro-vision of cutting surface
Focus :  Auto focus in <30 seconds

KEY BENIFITS

FAST AND ACCURATE

  • Drilling of 8 mm super alloy straight hole (diameter 30 mil/ 0.76mm) in 70 sec.
  • High mechanical precision with a tolerance of +/- 1 μm (very small kerfs from 25-75 μm)
  • High aspect ratio in hole drilling (up to 1:25) of 20 mm superalloy

USER-FRIENDLY

  • No focus control necessary due to long working distance
  • No need of cutting assist gas or protective layers
  • No or very little post treatment, metal foils cut without burs

SMOOTH AND CLEAN

  • No focusing beam convergence resulting in perfectly parallel kerfs and drilled holes
  • No mechanical stress and virtually no heat impact thanks to the water jet cooling capability
  • Cleaner surfaces and less scrap since all waste products are removed with the water flow

LOW RUNNING COSTS

  • Very few consumables
  • No tool wear
  • Low waste rates

GENERAL SPECIFICATION

Version   MCS-300
Working volume mm (W x D x H)   400 x 300 x 200
Accuracy µm   +/-1
Repeatability µm   +/-1
Number of axes   3-axis/ 3+1-axis
Laser Type   Diode pumped solid state Nd: YAG, pulsed
Wavelength nm   532/ 1064
Dimensions machine mm (W x D x H)   2140 x 4300 x 2000

MAIN INDUSTRIES AND APPLICATIONS

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